High Thermal Conductivity Heat Dissipating Pad 2.0mm


n64pt53 - 2.0mm thick. This is a High Thermal Conductivity Pad for dissipating heat from your Nintendo N64, Gamecube, or other CPU or GPU heat sink or heat-producing chips. It has a thermal conductivity of 15 w/mk, and can be cut to size. This is non-corrosive, non-curing, and non-toxic. The padding material is soft silicone padding for heat dissipation with a density of (g/cc): 3.1±0.2 and a hardness of (Sc): 30~55. The breakdown voltage is >_9.8(kv@1mm).

Brand New - Product Details

  • Platform: Nintendo 64 Entertainment System (N64), Nintendo GameCube System (GCN), or other CPU systems
  • Part: High Thermal Conductivity Pad
  • Size: 85x45x2.0mm
  • Type: Heat Exchanger
  • Density3.1+0.2(g/cc): Region Free
  • ESRB Rating: "N/A"
  • Class: A
  • Condition: New

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This product was added to our catalog on Monday 27 June, 2022.

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